The thickness range of the beryllium copper round plates is 6 to 200 millimeters.
The C17510 beryllium-copper round plate possesses both high strength and high hardness. Its tensile strength can reach over 440 MPa, the yield strength exceeds 200 MPa, the elongation rate is greater than 35%, and the hardness reaches above 85 HV. It also has excellent elastic modulus and fatigue strength, making it suitable for scenarios that require high variable loads.
The C17510 beryllium copper round plate is mainly composed of copper, zinc and a small amount of beryllium and other elements. It is processed through precise casting technology. This C17510 beryllium copper round plate material not only has high strength and hardness, but also exhibits excellent corrosion resistance, enabling it to maintain stable performance in various harsh environments. Moreover, the C17510 beryllium copper round plate has excellent electrical conductivity, making it the preferred material in the electrical field. Its surface color is golden, which also provides extensive application space in art production.
For the cutting processing of the C17510 beryllium copper round plate, common methods include mechanical cutting, flame cutting, plasma cutting and laser cutting. The choice of which cutting method depends on factors such as the thickness of the material, shape, precision requirements and production efficiency.
Mechanical Cutting
Mechanical cutting is suitable for small-batch production and cutting tasks with simple shapes. The commonly used cutting tools for C17510 beryllium copper round plates include band saws, shearing machines, presses and cutting line machines, etc. The advantage of mechanical cutting lies in its simple equipment and convenient operation. However, when the requirements for cutting accuracy and surface quality are high, it may not achieve the desired effect.
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