Copper content: 95.7 - 97.1%
Forming process: Extrusion
Surface treatment process: Polishing
Specifications: 0.5*600*1500, 0.6*600*1500
Tensile strength (MPa): 1105
Production process: Rolling
Applications: Aerospace, Electronics and Electrical, Machinery Manufacturing
Copper content: 95.7 - 97.1%
Forming process: Extrusion
Surface treatment process: Polishing
Specifications: 0.5*600*1500, 0.6*600*1500
Tensile strength (MPa): 1105
Thickness range
The regular thickness usually falls within the range of 0.5mm to 3mm, and custom ultra-thin or thickened specifications are also available.
Dimensions and tolerances
Length, width, etc. can be customized according to customer requirements. The common tolerance range needs to be negotiated specifically. Surface treatment
Different surface treatment methods such as black finish, polished finish, sandblasted finish or acid washed finish can be provided.
Performance Parameters
Hardness: HRB ≥ 95 (after quenching and tempering)
Electrical Conductivity: ≥ 50% IACS (International Annealed Copper Standard)
Thermal Conductivity: ≥ 210% W/m·K (at 20°C)
Application Scenarios
The high-hardness C17510 beryllium copper plate is mainly used in resistance welding electrodes, precision molds, corrosion-resistant components, etc.
When purchasing high-hardness C17510 beryllium copper plates, the thickness, size, and surface treatment method need to be determined according to actual requirements. It is recommended to contact the supplier for detailed technical parameters.
High-hardness C17510 beryllium copper plate. The thickness of copper plates is generally divided into thin plates and medium-thick plates. The thickness of thin plates ranges from 0.1mm to 3.0mm, while the thickness of medium-thick plates ranges from 3.0mm to 200mm.
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